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珠海越亚专注于无芯IC封装基板的研发、设计、生产以及销售,致力成为一家世界领先的封装基板、半导体模组、半导体器件的解决方案提供商。公司成立于2006年,最早由中、以两国企业合资组建,专注于高端有机无芯封装基板的发明专利的产业化。经过不断的创新与发展,公司成为世界上首家采用“铜柱法”生产高密度无芯封装基板并实现量产的创新型企业,是国家高新技术企业,广东省民营科技企业以及珠海市知识产权优势企业,设有广东省工程技术中心;其“高可靠RF Module系统级封装基板制造技术”荣获2013年度广东省科学技术奖二等奖;2012年7...

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ACCESS Unique Capa...

Embedded PassiveDescription: ACCESS has developed thin film capacitor technology for embedded passive or IPD design into substrate. EPS technology has been passed reliability test by customers. The characteristics of EPS technology are better signal integrity, lower signal noise and thinner package size.Applications: Portable device, graphic and network productsEmbedded ActiveDescription: ACCESS has developed seamless Die to package interconnects solution with patented via-in-frame, an alternative solution of low cost and high performance assembly solution with Access mature panel level substrate, no need wafer bumping, no any laser via, shorten fab to package and time to market, using thicker copper RDL and via or bar-via post .Applications: Power, Sensor, GaN, Regulator, RF wireless, etcAny-Shape Any-Layer Bar via postDescription: ACCESS provide minimum > 40um via, and also any shape bar via post in any layer. All via post are with vertical and smooth surface without any dimple, which can bring excellent RF performance and best heat dissipation.Applications: High Power, High Speed, High Frequency, GaN, CPU, GPU, PMU, IoT, VR, AI, etcHybrid SubstrateDescription: This is a flexible dielectric material design for high frequency product. It is also suitable for high – density layout design, ACCESS can provide,Odd or Even LayersPrepreg and Film CombinationsBoT, BoP, Cu Stumps, Sn μBumpsSolder Mask: Wet, Film, PS & Non PSVia: Ultra fine, Oblong, Bar, StackedOSP, Ni/Au, Thin Ni ENEPIG, ULA SnEmbedded TraceDescription: ACCESS provides embedded trace technology for low layer counts substrate requirement. It can be applied to 2 ~ 4layers substrate and the current line/space capability for embedded trace technology is 15/15um.Ultra Thin dielectricsDescription: ACCESS can provides minimum 20um or 25um to all dielectric thickness by unique coreless technology, it is suitable to apply 2 ~ 18 layers.Bond on Pillar (BoP)Description: ACCESS provides BoP technology that was developed to meet flip chip substrate’s ultra fine bump pitch requirements; it is available to apply for 90um bump pitch. ACCESS can also provide oblong bump to apply into BoT (Bond on Trace) design to get better assembly yield.BoP TD (Thin Down)Description: ACCESS also provides BoP Thin Down technology, there is 7um min Cu height above the solder resist material.